Qualcomm’s newly unveiled mobile application processor (AP), the Snapdragon 8 Elite, demonstrates significant performance improvements over its predecessor and reportedly surpasses the A18 Pro chipset in Apple’s iPhone 16 Pro. This advancement is expected to strengthen Samsung Electronics’ Galaxy series smartphones in the premium market while further challenging Samsung’s AP business.

According to reports from Seoul Economic Daily and Chosun Biz, following the launch of the notebook chip Snapdragon X Elite, equipped with the first generation Oryon CPU, in June 2024, the Snapdragon 8 Elite features a second-generation Oryon CPU. The processor consists of two flagship cores operating at frequencies up to 4.32 GHz, paired with six performance cores reaching frequencies of up to 3.53 GHz.

Qualcomm reports that compared to the previous generation Snapdragon 8 Gen 3, the Snapdragon 8 Elite offers a 45% boost in CPU speed, a 40% boost in GPU speed, and a 45% boost in NPU speed. The company claims the second-generation Oryon CPU outperforms Apple’s latest A18 Pro chipset across various benchmark tests, positioning it as the fastest mobile CPU globally.

Moreover, the Snapdragon 8 Elite has made strides in power consumption, reducing total power usage by 27% and improving performance-per-watt by 45%, enhancing on-device AI capabilities. These improvements are attributed to both its design and TSMC’s second-generation 3nm (N3E) process technology.

Industry analyses suggest that with Samsung likely adopting the Snapdragon 8 Elite for its upcoming Galaxy S25 series, superior performance compared to Apple’s chipset would strengthen Samsung’s position in the flagship smartphone market.

However, this development presents challenges for Samsung in the AP market, where it faces an increasing competitive disparity with Qualcomm.

While Samsung’s self-developed 4nm AP, the Exynos 2400, initially showed performance levels comparable to Qualcomm’s Snapdragon 8 Gen 3 and was incorporated into some Galaxy S24 models, the transition to 3nm technology has widened the gap. Qualcomm has achieved substantial performance leaps while Samsung’s Exynos 2500 continues to struggle with yield issues, potentially leading to all Galaxy S25 models adopting Qualcomm chips.

MediaTek’s Dimensity 9400, manufactured using TSMC’s 3nm process, has shown impressive performance while maintaining a price point 20-30% lower than Qualcomm’s chips. The company is successfully capturing market share among Chinese smartphone manufacturers. Recent rumors indicate that Samsung might consider incorporating the Dimensity 9400 into certain models of the Galaxy S25 series to reduce production costs.

Industry sources indicate that MediaTek benefits from TSMC’s stable 3nm manufacturing process, enhancing AP performance in high-end smartphones from Vivo and Oppo. Meanwhile, Samsung, in its efforts to introduce GAA technology into its 3nm processes, has encountered yield problems in wafer fabrication, creating additional challenges for the AP business of Samsung System LSI.